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Reel/Frame:022991/0245   Pages: 6
Recorded: 07/22/2009
Attorney Dkt #:1004378.54150
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/05/2013
Application #:
11919368
Filing Dt:
09/10/2009
Publication #:
Pub Dt:
12/24/2009
Title:
HEAT SINK FOR POWER MODULE
Assignors
1
Exec Dt:
10/10/2007
2
Exec Dt:
10/12/2007
3
Exec Dt:
10/09/2007
4
Exec Dt:
10/11/2007
5
Exec Dt:
10/26/2007
6
Exec Dt:
10/27/2007
7
Exec Dt:
10/10/2007
8
Exec Dt:
10/04/2007
9
Exec Dt:
10/04/2007
10
Exec Dt:
10/04/2007
Assignees
1
2-1, TOYODA-CHO, KARIYA-SHI
AICHI-KEN, JAPAN 448-8671
2
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU
TOKYO, JAPAN 105-8518
Correspondence name and address
LOCKE LORD BISSELL & LIDDELL LLP ATTN: I
THREE WORLD FINANCIAL CENTER
NEW YORK, NY 10281-2101

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