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Reel/Frame:023035/0961   Pages: 7
Recorded: 07/31/2009
Attorney Dkt #:Q111388
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE SECOND ASSIGNEE WAS OMITTED PREVIOUSLY RECORDED ON REEL 022592 FRAME 0186. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECTED ASSIGNMENT.
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12344023
Filing Dt:
12/24/2008
Publication #:
Pub Dt:
08/06/2009
Title:
SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES
Assignors
1
Exec Dt:
01/12/2009
2
Exec Dt:
01/12/2009
3
Exec Dt:
01/12/2009
4
Exec Dt:
01/12/2009
5
Exec Dt:
01/12/2009
6
Exec Dt:
01/12/2009
7
Exec Dt:
01/12/2009
8
Exec Dt:
01/12/2009
9
Exec Dt:
01/12/2009
Assignees
1
GUSTAV-HEINEMANN-RING 212
MUNICH, GERMANY 81739
2
5 SERANGOON NORTH AVENUE 5
SINGAPORE, SINGAPORE 554916
Correspondence name and address
CARL J. PELLEGRINI
2100 PENNSYLVANIA AVENUE, N.W.
WASHINGTON, DC 20037

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