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Reel/Frame:023067/0951   Pages: 4
Recorded: 08/07/2009
Attorney Dkt #:LIC-312
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12537441
Filing Dt:
08/07/2009
Publication #:
Pub Dt:
10/21/2010
Title:
PACKAGE STRUCTURE OF PRINTED CIRCUIT BOARD AND PACKAGE METHOD THEREOF
Assignors
1
Exec Dt:
08/03/2009
2
Exec Dt:
08/03/2009
3
Exec Dt:
08/03/2009
4
Exec Dt:
08/03/2009
Assignees
1
NO.25, GUANGPU WEST ROAD, GUANGZHOU SCIENCE PARK, GUANGZHOU HIGH AND NEW TECHNOLOGY INDUSTRY DEVELOPMENT ZONE,
GUANGZHOU, CHINA
2
22F, NO.392, RUEY KUANG ROAD, NEIHU DIST.,
TAIPEI CITY, TAIWAN
Correspondence name and address
STEVEN M. RABIN
SUITE 500, 1101 14TH STREET, N.W.
WASHINGTON, DC 20005

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