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Reel/Frame:023077/0092   Pages: 3
Recorded: 07/30/2009
Attorney Dkt #:TAI-216
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12461051
Filing Dt:
07/30/2009
Publication #:
Pub Dt:
02/04/2010
Title:
Semiconductor device and fabrication method thereof
Assignors
1
Exec Dt:
07/12/2009
2
Exec Dt:
07/05/2009
3
Exec Dt:
06/26/2009
4
Exec Dt:
07/17/2009
Assignee
1
550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI
TOKYO 193-8550, JAPAN
Correspondence name and address
ROBERT H. BERDO, JR.
RABIN & BERDO, PC
1101 14TH ST., NW, SUITE 500
WASHINGTON, DC 20005

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