Patent Assignment Details
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| Reel/Frame: | 023135/0378 | |
| Pages: | 3 |
| | Recorded: | 06/09/2009 | | |
| Attorney Dkt #: | 030891 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/22/2009
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Application #:
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10623679
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Filing Dt:
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07/22/2003
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Publication #:
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Pub Dt:
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05/20/2004
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Title:
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RESIST PATTERN THICKENING MATERIAL, RESIST PATTERN AND PROCESS FOR FORMING THE SAME, AND SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING THE SAME
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Assignee
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| 1-1, KAMIKODANAKA 4-CHOME |
| NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA 211-8588, JAPAN |
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Correspondence name and address
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WESTERMAN, HATTORI, DANIELS & ADRIAN, LL
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1250 CONNECTICUT AVENUE, NW
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SUITE 700
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WASHINGTON, DC 20036
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