Patent Assignment Details
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| Reel/Frame: | 023199/0049 | |
| Pages: | 2 |
| | Recorded: | 09/07/2009 | | |
| Attorney Dkt #: | 84787(71987) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/06/2012
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Application #:
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12554389
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Filing Dt:
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09/04/2009
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Publication #:
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Pub Dt:
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03/10/2011
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Title:
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PACKAGE SUBSTRATE HAVING SEMICONDUCTOR COMPONENT EMBEDDED THEREIN AND FABRICATION METHOD THEREOF
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Assignee
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| NO. 6, LI-HSIN ROAD, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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Correspondence name and address
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PETER F. CORLESS
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P.O. BOX 55874
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BOSTON, MA 02205
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