Patent Assignment Details
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Reel/Frame: | 023262/0182 | |
| Pages: | 4 |
| | Recorded: | 09/15/2009 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/24/2012
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Application #:
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11990278
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Filing Dt:
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09/16/2009
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Publication #:
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Pub Dt:
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02/11/2010
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Title:
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LEAD-FREE SOLDER PASTE AND ITS USE
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Assignees
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23 SENJU-HASHIDO-CHO, ADACHI-KU |
TOKYO, JAPAN 120-8555 |
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10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI |
KYOTO, JAPAN 617-8555 |
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Correspondence name and address
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MICHAEL TOBIAS
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1629 K ST NW
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SUITE 300
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WASHINGTON, DC 20006
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