Patent Assignment Details
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| Reel/Frame: | 023285/0899 | |
| Pages: | 4 |
| | Recorded: | 09/25/2009 | | |
| Attorney Dkt #: | NMCIP076 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12532385
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Filing Dt:
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09/21/2009
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Publication #:
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Pub Dt:
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05/06/2010
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Title:
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METHOD OF AND APPARATUS FOR ABRADING OUTER PERIPHERAL PARTS OF A SEMICONDUCTOR WAFER
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Assignee
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| 3-4-1 MUSASHINO, AKISHIMA |
| TOKYO, JAPAN 196-0021 |
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Correspondence name and address
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WEAVER AUSTIN VILLENEUVE & SAMPSON LLP
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PO BOX 70250
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OAKLAND, CA 94612-0250
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