Patent Assignment Details
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| Reel/Frame: | 023298/0011 | |
| Pages: | 2 |
| | Recorded: | 09/29/2009 | | |
| Attorney Dkt #: | 8001-1431 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12569085
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Filing Dt:
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09/29/2009
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Publication #:
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Pub Dt:
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04/01/2010
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Title:
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Method of lead cutting of a Flat Package device for proper soldering by half blanking method
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Assignee
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| 1753 SHIMNOUMABE, NAKAHARA-KU, KAWASAKI |
| KANAGAWA, JAPAN 211-8668 |
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Correspondence name and address
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YOUNG & THOMPSON
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209 MADISON STREET
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SUITE 500
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ALEXANDRIA, VA 22314
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05/02/2024 01:31 PM
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