Patent Assignment Details
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| Reel/Frame: | 023334/0850 | |
| Pages: | 4 |
| | Recorded: | 10/06/2009 | | |
| Attorney Dkt #: | 01159_1027 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/26/2013
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Application #:
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12517551
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Filing Dt:
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10/06/2009
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Publication #:
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Pub Dt:
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02/11/2010
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Title:
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SEMICONDUCTOR PACKAGE, CORE LAYER MATERIAL, BUILDUP LAYER MATERIAL, AND SEALING RESIN COMPOSITION
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Assignee
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 1400002 |
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Correspondence name and address
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MASAYASU MORI
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918 PRINCE STREET
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ALEXANDRIA, VA 22314
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