Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 023343/0859 | |
| Pages: | 5 |
| | Recorded: | 09/30/2009 | | |
| Attorney Dkt #: | TSAI-436 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12585996
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Filing Dt:
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09/30/2009
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Publication #:
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Pub Dt:
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02/03/2011
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Title:
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Ball grid array printed circuit board, package structure, and fabricating method thereof
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Assignees
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| NO. 188, WEN HWA 2ND RD., KUEI SHAN HSIANG |
| TAO YUAN SHIEN, TAIWAN R.O.C. |
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| NO. 2, LN. 58, SAN-ZHUANG RD. |
| SONGJIANG EPZ SHANGHAI, CHINA |
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Correspondence name and address
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ROBERT H. BERDO, JR.
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RABIN & BERDO, PC
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1101 14TH STREET, NW
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SUITE 500
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WASHINGTON, DC 20005
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