Patent Assignment Details
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| Reel/Frame: | 023440/0255 | |
| Pages: | 2 |
| | Recorded: | 10/27/2009 | | |
| Attorney Dkt #: | OSC 121C1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/27/2010
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Application #:
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12007874
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Filing Dt:
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01/16/2008
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Publication #:
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Pub Dt:
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05/29/2008
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Title:
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RESIN FOR SEALING SEMICONDUCTOR DEVICE, RESIN-SEALED SEMICONDUCTOR DEVICE AND THE METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
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Assignee
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| 2-4-8 SHIN-YOKOHAMA, KOHOKU-KU |
| YOKOHAMA 222-8575, JAPAN |
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Correspondence name and address
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RABIN & BERDO, PC
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1101 14TH STREET, NW
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SUITE 500
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WASHINGTON, DC 20005
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