Patent Assignment Details
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Reel/Frame: | 023476/0212 | |
| Pages: | 4 |
| | Recorded: | 11/05/2009 | | |
Attorney Dkt #: | 2515.0154 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/23/2014
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Application #:
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12612938
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Filing Dt:
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11/05/2009
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Publication #:
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Pub Dt:
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05/27/2010
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Title:
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Semiconductor Device and Method of Forming WLCSP Using Wafer Sections Containing Multiple Die
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Assignee
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10 ANG MO KIO STREET 65 |
#05-17/20 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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ROBERT D. ATKINS
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605 W. KNOX ROAD
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SUITE 104
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TEMPE, AZ 85284
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