Patent Assignment Details
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| Reel/Frame: | 023630/0877 | |
| Pages: | 4 |
| | Recorded: | 12/09/2009 | | |
| Attorney Dkt #: | 705895 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/28/2012
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Application #:
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12634350
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Filing Dt:
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12/09/2009
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Publication #:
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Pub Dt:
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06/17/2010
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Title:
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MANUFACTURING METHOD OF TRANSFERRING A WIRING CIRCUIT LAYER ON A METAL SUPPORT SUBSTRATE TO A SEMICONDUCTOR ELEMENT
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Assignee
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| 1-2, SHIMOHOZUMI 1-CHOME |
| IBARAKI-SHI, JAPAN 567-8680 |
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Correspondence name and address
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LEYDIG VOIT & MAYER, LTD
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TWO PRUDENTIAL PLAZA, SUITE 4900
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180 NORTH STETSON AVENUE
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CHICAGO, IL 60601-6731
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