Patent Assignment Details
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| Reel/Frame: | 023638/0297 | |
| Pages: | 4 |
| | Recorded: | 12/11/2009 | | |
| Attorney Dkt #: | 033036 M 176 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/16/2011
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Application #:
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12664003
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Filing Dt:
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12/10/2009
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Publication #:
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Pub Dt:
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07/22/2010
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Title:
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RESIN COMPOSITION, FILLING MATERIAL, INSULATING LAYER AND SEMICONDUCTOR DEVICE
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Assignee
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 140-0002 |
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Correspondence name and address
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MICHAEL A. MAKUCH
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1130 CONNECTICUT AVENUE, N.W.,SUITE 1130
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SMITH, GAMBRELL & RUSSELL
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ATLANTA, GA 30309
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