Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 023698/0517 | |
| Pages: | 30 |
| | Recorded: | 12/23/2009 | | |
| Attorney Dkt #: | 1700.0034CON&1700.0035DIV |
| Conveyance: | CARVE-OUT AND CONTRIBUTION AGREEMENT |
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Total properties:
2
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Patent #:
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Issue Dt:
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10/26/2010
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Application #:
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11124515
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Filing Dt:
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05/06/2005
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Publication #:
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Pub Dt:
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09/22/2005
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Title:
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METHOD OF PRODUCING AN ELECTRONIC COMPONENT WITH FLEXIBLE BONDING PADS
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Patent #:
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Issue Dt:
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01/08/2013
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Application #:
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11928941
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Filing Dt:
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10/30/2007
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Publication #:
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Pub Dt:
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02/28/2008
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Title:
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ELECTRONIC COMPONENT WITH SEMICONDUCTOR CHIPS, ELECTRONIC ASSEMBLY COMPOSED OF STACKED SEMICONDUCTOR CHIPS, AND METHODS FOR PRODUCING AN ELECTRONIC COMPONENT AND AN ELECTRONIC ASSEMBLY
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Assignee
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| GUSTAV-HEINEMANN-RING 212 |
| MUNICH, GERMANY 81739 |
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Correspondence name and address
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PATRICK FINNAN (EDELL, SHAPIRO & FINNAN)
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1901 RESEARCH BLVD.
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SUITE 400
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ROCKVILLE, MD 20850
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