Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 023705/0831 | |
| Pages: | 6 |
| | Recorded: | 12/28/2009 | | |
| Attorney Dkt #: | 6550.007 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12647612
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Filing Dt:
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12/28/2009
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Publication #:
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Pub Dt:
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07/01/2010
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Title:
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CMP Slurry Composition for Barrier Polishing for Manufacturing Copper Interconnects, Polishing Method Using the Composition, and Semiconductor Device Manufactured by the Method
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Assignee
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| 290 GONGDAN-DONG |
| GUMI-SI |
| GYEONGSANGBUK-DO, KOREA, REPUBLIC OF 730-710 |
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Correspondence name and address
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MELISSA B. PENDLETON
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11610 N. COMMUNITY HOUSE ROAD
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SUITE 200
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CHARLOTTE, NC 28277
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