Patent Assignment Details
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| Reel/Frame: | 023712/0937 | |
| Pages: | 3 |
| | Recorded: | 12/29/2009 | | |
| Attorney Dkt #: | YGUC.3915 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12646819
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Filing Dt:
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12/23/2009
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Publication #:
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Pub Dt:
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07/01/2010
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Title:
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SOLDER BATH AND METHOD OF HEATING SOLDER CONTAINED IN THE SOLDER BATH
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Assignee
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| 23 SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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CHERNOFF VILHAUER MCCLUNG & STENZEL LLP
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601 SW 2ND AVE., STE. 1600
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PORTLAND, OR 97204
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