Patent Assignment Details
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| Reel/Frame: | 023777/0827 | |
| Pages: | 3 |
| | Recorded: | 01/13/2010 | | |
| Attorney Dkt #: | 143327 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/29/2013
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Application #:
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12588659
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Filing Dt:
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10/22/2009
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Publication #:
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Pub Dt:
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04/28/2011
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Title:
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Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same
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Assignees
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| 678 S. HILLVIEW DR. |
| MILPITAS, CALIFORNIA 95035 |
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| SAE TECHNOLOGY CENTRE |
| 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK |
| SHATIN, N.T., HONG KONG, CHINA |
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Correspondence name and address
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JAMES A. OLIFF
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OLIFF & BERRIDGE, PLC
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P.O. BOX 320850
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ALEXANDRIA, VA 22320-4850
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