Patent Assignment Details
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| Reel/Frame: | 023798/0443 | |
| Pages: | 4 |
| | Recorded: | 01/15/2010 | | |
| Attorney Dkt #: | Q116607 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/09/2012
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Application #:
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12669346
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Filing Dt:
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01/15/2010
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Publication #:
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Pub Dt:
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08/05/2010
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Title:
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SOLDER MATERIAL, METHOD FOR MANUFACTURING THE SAME, JOINED BODY, METHOD FOR MANUFACTURING THE SAME, POWER SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING THE SAME
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Assignees
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| 1, TOYOTA-CHO |
| TOYOTA-SHI, AICHI, JAPAN 471-8571 |
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| 1-1, KATAHIRA 2-CHOME, AOBA-KU |
| SENDAI-SHI, MIYAGI, JAPAN 980-8577 |
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Correspondence name and address
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SUGHRUE MION, PLLC
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2100 PENNSYLVANIA AVENUE, N.W.
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SUITE 800
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WASHINGTON, DC 20037-3213
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