Patent Assignment Details
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Reel/Frame: | 023846/0753 | |
| Pages: | 4 |
| | Recorded: | 01/26/2010 | | |
Attorney Dkt #: | 09864/0213424-US0 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/30/2012
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Application #:
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12669662
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Filing Dt:
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06/25/2010
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Publication #:
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Pub Dt:
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11/25/2010
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Title:
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BONDING WIRE FOR SEMICONDUCTOR DEVICES
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Assignees
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14-1, SOTOKANDA 4-CHOME, CHIYODA-KU |
TOKYO, JAPAN 1010021 |
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158-1, OAZA SAYAMAGAHARA, IRUMA-SHI |
SAITAMA, JAPAN 3580032 |
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Correspondence name and address
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ROBERT J. SACCO
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P.O. BOX 770, CHURCH STREET STATION
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NEW YORK, NY 10008-0770
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