Patent Assignment Details
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| Reel/Frame: | 023876/0169 | |
| Pages: | 3 |
| | Recorded: | 01/29/2010 | | |
| Attorney Dkt #: | 143408 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO RE-RECORD ASSIGNEE NAME AND ADDRESS ON AN ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED ON 01/20/2010. REEL 023823 FRAME 0324. |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/08/2011
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Application #:
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12588808
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Filing Dt:
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10/28/2009
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Title:
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COMPOSITE LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME
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Assignees
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| 678 S. HILLVIEW DR. |
| MILPITAS, CALIFORNIA 95035, U.S.A. |
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| SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE |
| HONG KONG SCIENCE PARK |
| SHATIN, N.T., HONG KONG, CHINA |
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Correspondence name and address
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JAMES A. OLIFF
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OLIFF & BERRIDGE, PLC
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P.O. BOX 320850
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ALEXANDRIA, VA 22320-4850
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