Patent Assignment Details
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Reel/Frame: | 023947/0305 | |
| Pages: | 4 |
| | Recorded: | 02/16/2010 | | |
Attorney Dkt #: | 143351 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/03/2013
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Application #:
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12588713
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Filing Dt:
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10/26/2009
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Publication #:
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Pub Dt:
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04/28/2011
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Title:
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Laminated chips package, semiconductor substrate and method of manufacturing the laminated chips package
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Assignees
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678 S. HILLVIEW DR. |
MILPITAS, CALIFORNIA 95035 |
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SAE TECHNOLOGY CENTRE |
6 SCIENCE PARK EAST AVENUE |
HONG KONG SCIENCE PARK, SHATIN, N.T., HONG KONG |
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Correspondence name and address
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JAMES A. OLIFF
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OLIFF & BERRIDGE, PLC
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P.O. BOX 320850
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ALEXANDRIA, VA 22320-4850
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