Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 023973/0941 | |
| Pages: | 4 |
| | Recorded: | 02/12/2010 | | |
Attorney Dkt #: | TIPI 5.2-009 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR'S NAME. DOCUMENT PREVIOUSLY RECORDED AT REEL 023778 FRAME 0084 |
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Total properties:
6
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Patent #:
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Issue Dt:
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08/13/1996
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Application #:
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08396084
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Filing Dt:
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02/28/1995
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Title:
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SEMICONDUCTOR DEVICE ASSEMBLY WITH MINIMIZED BOND FINGER CONNECTIONS
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Patent #:
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Issue Dt:
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03/13/2001
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Application #:
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09010414
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Filing Dt:
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01/21/1998
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Title:
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LOW COST THERMALLY ENHANCED FLIP CHIP BGA
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Patent #:
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Issue Dt:
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12/11/2001
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Application #:
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09476958
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Filing Dt:
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01/03/2000
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Title:
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MULTIPLE ROW WIRE BONDING WITH BALL BONDS OF OUTER BOND PADS BONDED ON THE LEADS
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Patent #:
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Issue Dt:
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10/29/2002
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Application #:
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09944964
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Filing Dt:
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08/31/2001
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Title:
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ENHANCED LAMINATE FLIPCHIP PACKAGE USING A HIGH CTE HEATSPREADER
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Patent #:
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Issue Dt:
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07/29/2008
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Application #:
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11122370
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Filing Dt:
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05/05/2005
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Publication #:
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Pub Dt:
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11/09/2006
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Title:
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BALL GRID ARRAY ASSIGNMENT
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Patent #:
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Issue Dt:
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08/19/2008
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Application #:
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11193808
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Filing Dt:
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07/29/2005
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Publication #:
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Pub Dt:
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02/01/2007
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Title:
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HIGH SPEED INTERFACE DESIGN
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Assignee
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3025 ORCHARD PARKWAY |
SAN JOSE, CALIFORNIA 95134 |
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Correspondence name and address
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DARYL K. NEFF
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LERNER, DAVID, LITTENBERG, ET AL
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600 SOUTH AVENUE WEST
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WESTFIELD, NJ 07090
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