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Patent Assignment Details
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Reel/Frame:023973/0941   Pages: 4
Recorded: 02/12/2010
Attorney Dkt #:TIPI 5.2-009
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR'S NAME. DOCUMENT PREVIOUSLY RECORDED AT REEL 023778 FRAME 0084
Total properties: 6
1
Patent #:
Issue Dt:
08/13/1996
Application #:
08396084
Filing Dt:
02/28/1995
Title:
SEMICONDUCTOR DEVICE ASSEMBLY WITH MINIMIZED BOND FINGER CONNECTIONS
2
Patent #:
Issue Dt:
03/13/2001
Application #:
09010414
Filing Dt:
01/21/1998
Title:
LOW COST THERMALLY ENHANCED FLIP CHIP BGA
3
Patent #:
Issue Dt:
12/11/2001
Application #:
09476958
Filing Dt:
01/03/2000
Title:
MULTIPLE ROW WIRE BONDING WITH BALL BONDS OF OUTER BOND PADS BONDED ON THE LEADS
4
Patent #:
Issue Dt:
10/29/2002
Application #:
09944964
Filing Dt:
08/31/2001
Title:
ENHANCED LAMINATE FLIPCHIP PACKAGE USING A HIGH CTE HEATSPREADER
5
Patent #:
Issue Dt:
07/29/2008
Application #:
11122370
Filing Dt:
05/05/2005
Publication #:
Pub Dt:
11/09/2006
Title:
BALL GRID ARRAY ASSIGNMENT
6
Patent #:
Issue Dt:
08/19/2008
Application #:
11193808
Filing Dt:
07/29/2005
Publication #:
Pub Dt:
02/01/2007
Title:
HIGH SPEED INTERFACE DESIGN
Assignor
1
Exec Dt:
12/17/2009
Assignee
1
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
Correspondence name and address
DARYL K. NEFF
LERNER, DAVID, LITTENBERG, ET AL
600 SOUTH AVENUE WEST
WESTFIELD, NJ 07090

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