|
Total properties:
10
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/14/2012
|
Application #:
|
12422694
|
Filing Dt:
|
04/13/2009
|
|
Publication #:
|
|
Pub Dt:
|
10/14/2010
| | | | |
|
Title:
|
INTEGRATED CIRCUIT SYSTEM WITH A FLOATING DIELECTRIC REGION AND METHOD OF MANUFACTURE THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/22/2011
|
Application #:
|
12429916
|
Filing Dt:
|
04/24/2009
|
|
Publication #:
|
|
Pub Dt:
|
10/28/2010
| | | | |
|
Title:
|
INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/04/2014
|
Application #:
|
12432162
|
Filing Dt:
|
04/29/2009
|
|
Publication #:
|
|
Pub Dt:
|
11/04/2010
| | | | |
|
Title:
|
INTEGRATED CIRCUIT COMMUNICATION SYSTEM WITH DIFFERENTIAL SIGNAL AND METHOD OF MANUFACTURE THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/02/2013
|
Application #:
|
12465431
|
Filing Dt:
|
05/13/2009
|
|
Publication #:
|
|
Pub Dt:
|
11/18/2010
| | | | |
|
Title:
|
MASK SYSTEM EMPLOYING SUBSTANTIALLY CIRCULAR OPTICAL PROXIMITY CORRECTION TARGET AND METHOD OF MANUFACTURE THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2011
|
Application #:
|
12470028
|
Filing Dt:
|
05/21/2009
|
|
Publication #:
|
|
Pub Dt:
|
11/25/2010
| | | | |
|
Title:
|
METHOD OF MANUFACTURE AN INTEGRATED CIRCUIT SYSTEM WITH THROUGH SILICON VIA
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12471803
|
Filing Dt:
|
05/26/2009
|
|
Publication #:
|
|
Pub Dt:
|
12/02/2010
| | | | |
|
Title:
|
INTEGRATED CIRCUIT SYSTEM WITH VERTICAL CONTROL GATE AND METHOD OF MANUFACTURE THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/20/2012
|
Application #:
|
12488451
|
Filing Dt:
|
06/19/2009
|
|
Publication #:
|
|
Pub Dt:
|
12/23/2010
| | | | |
|
Title:
|
INTEGRATED CIRCUIT SYSTEM WITH HIGH VOLTAGE TRANSISTOR AND METHOD OF MANUFACTURE THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/09/2012
|
Application #:
|
12541373
|
Filing Dt:
|
08/14/2009
|
|
Publication #:
|
|
Pub Dt:
|
02/17/2011
| | | | |
|
Title:
|
INTEGRATED CIRCUIT SYSTEM WITH SEALRING AND METHOD OF MANUFACTURE THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/13/2015
|
Application #:
|
12544747
|
Filing Dt:
|
08/20/2009
|
|
Publication #:
|
|
Pub Dt:
|
02/24/2011
| | | | |
|
Title:
|
INTEGRATED CIRCUIT SYSTEM WITH BAND TO BAND TUNNELING AND METHOD OF MANUFACTURE THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/10/2013
|
Application #:
|
12613224
|
Filing Dt:
|
11/05/2009
|
|
Publication #:
|
|
Pub Dt:
|
05/05/2011
| | | | |
|
Title:
|
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CORE REGION AND BOND PAD AND METHOD OF MANUFACTURE THEREOF
|
|
