Patent Assignment Details
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| Reel/Frame: | 024130/0359 | |
| Pages: | 3 |
| | Recorded: | 03/24/2010 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/01/2013
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Application #:
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12679731
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Filing Dt:
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03/24/2010
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Publication #:
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Pub Dt:
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11/11/2010
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Title:
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SEMICONDUCTOR WAFER MANUFACTURING METHOD
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Assignee
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| 1324-2, MASURAGAHARA-MACHI, OMURA-SHI, |
| NAGASAKI, JAPAN 856-8555 |
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Correspondence name and address
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FRISHAUF, HOLTZ, GOODMAN & CHICK, PC
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220 FIFTH AVENUE
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NEW YORK, NY 10001-7708
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