Patent Assignment Details
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| Reel/Frame: | 024173/0815 | |
| Pages: | 4 |
| | Recorded: | 04/01/2010 | | |
| Attorney Dkt #: | CHIP.0109 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/25/2012
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Application #:
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12752345
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Filing Dt:
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04/01/2010
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Publication #:
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Pub Dt:
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08/04/2011
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Title:
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THREE-DIMENSIONAL SOC STRUCTURE FORMED BY STACKING MULTIPLE CHIP MODULES
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Assignee
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| 7F. NO. 26, PROSPERITY RD. 1, SCIENCE PARK |
| HSINCHU CITY, TAIWAN 300 |
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Correspondence name and address
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JUAN CARLOS A. MARQUEZ
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1199 N. FAIRFAX STREET, SUITE 900
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STITES & HARBISON PLLC
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ALEXANDRIA, VA 22314
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