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Reel/Frame:024199/0743   Pages: 2
Recorded: 03/30/2010
Attorney Dkt #:10162/HG
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12798142
Filing Dt:
03/30/2010
Publication #:
Pub Dt:
09/30/2010
Title:
Liquid resin composition for underfill, flip-chip mounted body and method for manufacturing the same
Assignors
1
Exec Dt:
03/25/2010
2
Exec Dt:
03/25/2010
Assignee
1
3993, NIGORIKAWA, NIIGATA-SHI
NIIGATA 950-3131, JAPAN
Correspondence name and address
FRISHAUF, HOLTZ, GOODMAN & CHICK, P.C.
220 FIFTH AVENUE, 16TH FLOOR
NEW YORK, NEW YORK 10001-7708

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