Patent Assignment Details
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| Reel/Frame: | 024200/0282 | |
| Pages: | 2 |
| | Recorded: | 03/31/2010 | | |
| Attorney Dkt #: | 1614.1780 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/25/2012
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Application #:
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12662136
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Filing Dt:
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03/31/2010
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Publication #:
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Pub Dt:
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08/05/2010
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Title:
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PACKAGING DESIGN SUPPORTING DEVICE AND PACKAGING DESIGN SUPPORTING METHOD FOR SEMICONDUCTOR INTEGRATED CIRCUIT AND RECORDING MEDIUM
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Assignee
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| 1-1, KAMIKODANAKA 4-CHOME |
| NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA 211-8588, JAPAN |
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Correspondence name and address
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STAAS & HALSEY LLP
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ATTN: DAVID M. PITCHER
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1201 NEW YORK AVENUE, N.W., SUITE 700
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WASHINGTON, D.C. 20005
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