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Patent Assignment Details
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Reel/Frame:024252/0644   Pages: 4
Recorded: 04/20/2010
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 3
1
Patent #:
Issue Dt:
02/08/2005
Application #:
10174956
Filing Dt:
06/20/2002
Publication #:
Pub Dt:
01/23/2003
Title:
METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD
2
Patent #:
Issue Dt:
10/12/2004
Application #:
10175912
Filing Dt:
06/21/2002
Publication #:
Pub Dt:
01/23/2003
Title:
PRINTED CIRCUIT BOARD WITH A HEAT DISSIPATION ELEMENT, METHOD FOR MANUFACTURING THE PRINTED CIRCUIT BOARD, AND PACKAGE COMPRISING THE PRINTED CIRCUIT BOARD
3
Patent #:
Issue Dt:
08/29/2006
Application #:
10934556
Filing Dt:
09/07/2004
Publication #:
Pub Dt:
02/03/2005
Title:
PRINTED CIRCUIT BOARD WITH A HEAT DISSIPATION ELEMENT AND PACKAGE COMPRISING THE PRINTED CIRCUIT BOARD
Assignor
1
Exec Dt:
12/02/2009
Assignees
1
20 YOIDO-DONG, YOUNGDUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 150-721
2
33RD FLOOR, LG TWIN TOWER WEST, 20, YEOUIDO-DONG, YEONGDEUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 150-721
Correspondence name and address
KED & ASSOCIATES, LLP
P.O. BOX 221200
CHANTILLY, VA 20153-1200

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