Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 024272/0606 | |
| Pages: | 4 |
| | Recorded: | 04/22/2010 | | |
| Attorney Dkt #: | P-9999 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
9
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Patent #:
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Issue Dt:
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05/25/2004
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Application #:
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10291606
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Filing Dt:
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11/12/2002
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Publication #:
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Pub Dt:
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05/15/2003
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Title:
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METHOD FOR FORMING BONDING PADS
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Patent #:
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Issue Dt:
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03/16/2004
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Application #:
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10318303
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Filing Dt:
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12/13/2002
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Publication #:
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Pub Dt:
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06/19/2003
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Title:
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METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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02/01/2005
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Application #:
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10456565
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Filing Dt:
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06/09/2003
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Publication #:
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Pub Dt:
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01/01/2004
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Title:
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METHOD FOR FABRICATING CIRCUIT PATTERN OF PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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05/23/2006
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Application #:
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10743302
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Filing Dt:
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12/23/2003
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Publication #:
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Pub Dt:
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07/15/2004
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Title:
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METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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01/22/2008
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Application #:
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10769885
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Filing Dt:
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02/03/2004
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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METHOD FOR INTERCONNECTING MULTI-LAYER PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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08/21/2007
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Application #:
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10836219
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Filing Dt:
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05/03/2004
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Publication #:
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Pub Dt:
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10/14/2004
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Title:
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METHOD FOR FORMING BONDING PADS
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Patent #:
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Issue Dt:
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12/04/2007
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Application #:
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10837701
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Filing Dt:
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05/04/2004
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Publication #:
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Pub Dt:
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10/14/2004
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Title:
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BONDING PADS FOR A PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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04/24/2007
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Application #:
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10855557
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Filing Dt:
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05/28/2004
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Publication #:
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Pub Dt:
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12/02/2004
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Title:
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METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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03/13/2007
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Application #:
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10981778
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Filing Dt:
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11/05/2004
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Publication #:
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Pub Dt:
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05/12/2005
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Title:
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MULTI-LAYER PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF
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Assignees
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| 20 YEOUIDO-DONG, YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 150-721 |
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| 33RD FLOOR, LG TWIN TOWER WEST, 20 YEOUIDO-DONG, YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 150-721 |
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Correspondence name and address
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KED & ASSOCIATES, LLP
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P.O. BOX 221200
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CHANTILLY, VA 20153-1200
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