Patent Assignment Details
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| Reel/Frame: | 024278/0753 | |
| Pages: | 5 |
| | Recorded: | 04/25/2010 | | |
| Attorney Dkt #: | NAUP0086USA |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE DATE(S) OF EXECUTION AND THE SPELLING OF THE FIRST ASSIGNOR'S NAME INDICATED IN THE COVER SHEET PREVIOUSLY RECORDED ON REEL 010341 FRAME 0133. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/21/2001
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Application #:
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09421261
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Filing Dt:
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10/20/1999
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Title:
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METHOD OF FORMING A NODE CONTACT HOLE ON A SEMICONDUCTOR WAFER
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Assignee
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| NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
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Correspondence name and address
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WINSTON HSU
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P.O.BOX 506
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MERRIFIELD, VA 22116
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