Patent Assignment Details
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| Reel/Frame: | 024312/0145 | |
| Pages: | 7 |
| | Recorded: | 04/29/2010 | | |
| Attorney Dkt #: | 27-126 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/09/2007
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Application #:
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11164160
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Filing Dt:
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11/12/2005
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Publication #:
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Pub Dt:
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08/17/2006
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Title:
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STACKED DIE PACKAGE SYSTEM
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Assignee
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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Correspondence name and address
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MIKIO ISHIMARU
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LAW OFFICES OF MIKIO ISHIMARU
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333 W. EL CAMINO REAL, SUITE # 330
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SUNNYVALE, CA 94087
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