Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 024312/0382 | |
| Pages: | 5 |
| | Recorded: | 04/29/2010 | | |
Attorney Dkt #: | 0630-3917M |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
5
|
|
Patent #:
|
|
Issue Dt:
|
04/03/2001
|
Application #:
|
09332080
|
Filing Dt:
|
06/14/1999
|
Title:
|
METHOD AND FIXTURE FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
|
|
|
Patent #:
|
|
Issue Dt:
|
04/15/2003
|
Application #:
|
09604902
|
Filing Dt:
|
06/28/2000
|
Title:
|
MULTI-LAYER PRINTED CIRCUIT BOARD HAVING VIA HOLES FORMED FROM BOTH SIDES THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
11/04/2003
|
Application #:
|
09659575
|
Filing Dt:
|
09/11/2000
|
Title:
|
METHOD FOR FORMING EXPOSED PORTION OF CIRCUIT PATTERN IN PRINTED CIRCUIT BOARD
|
|
|
Patent #:
|
|
Issue Dt:
|
06/17/2003
|
Application #:
|
09832193
|
Filing Dt:
|
04/11/2001
|
Publication #:
|
|
Pub Dt:
|
10/11/2001
| | | | |
Title:
|
MULTI-LAYER PRINTED CIRCUIT BOARD AND FABRICATION METHOD THEREOF AND A BGA SEMICONDUCTOR PACKAGE USING THE MULTI-LAYER PRINTED CIRCUIT BOARD
|
|
|
Patent #:
|
|
Issue Dt:
|
04/26/2005
|
Application #:
|
10384658
|
Filing Dt:
|
03/11/2003
|
Publication #:
|
|
Pub Dt:
|
09/11/2003
| | | | |
Title:
|
MULTI-LAYER PRINTED CIRCUIT BOARD AND A BGA SEMICONDUCTOR PACKAGE USING THE MULTI-LAYER PRINTED CIRCUIT BOARD
|
|
Assignees
|
|
|
20, YEOUIDO-DONG, YEONGDEUNGPO-GU |
SEOUL, KOREA, REPUBLIC OF 150-721 |
|
|
|
20, YEOUIDO-DONG, YEONGDEUNGPO-GU |
SEOUL, KOREA, REPUBLIC OF 150-721 |
|
Correspondence name and address
|
|
BAUM
|
|
PO BOX 747
|
|
FALLS CHURCH, VA 22040-0747
|
Search Results as of:
05/02/2024 10:44 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|