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Reel/Frame:024312/0760   Pages: 6
Recorded: 04/30/2010
Attorney Dkt #:7031169001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/11/2002
Application #:
09726588
Filing Dt:
12/01/2000
Publication #:
Pub Dt:
09/06/2001
Title:
THERMOSETTING SOLDERING FLUX AND SOLDERING PROCESS
Assignor
1
Exec Dt:
06/15/2005
Assignee
1
23 SENJU-HASHIDOCHO, ADACHI-KU
TOKYO, JAPAN
Correspondence name and address
BINGHAM MCCUTCHEN LLP
2020 K STREET NW
WASHINGTON, DC 20006-1806

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