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Reel/Frame:024348/0001   Pages: 6
Recorded: 05/06/2010
Attorney Dkt #:069576-0612
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE THIRD ASSIGNOR'S NAME PREVIOUSLY RECORDED ON REEL 023719 FRAME 0262. ASSIGNOR(S) HEREBY CONFIRMS THE THIRD ASSIGNOR'S NAME SHOULD BE LISTED AS CHUNG, HAE SUK.
Total properties: 1
1
Patent #:
Issue Dt:
05/19/2015
Application #:
12650134
Filing Dt:
12/30/2009
Publication #:
Pub Dt:
09/23/2010
Title:
MULTILAYER CHIP CAPACITOR AND METHOD OF FABRICATING THE SAME
Assignors
1
Exec Dt:
12/03/2009
2
Exec Dt:
12/08/2009
3
Exec Dt:
12/08/2008
4
Exec Dt:
12/08/2009
5
Exec Dt:
12/08/2009
6
Exec Dt:
12/03/2009
Assignee
1
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON,
GYUNGGI-DO, KOREA, REPUBLIC OF
Correspondence name and address
MCDERMOTT WILL & EMERY LLP
600 13TH STREET, N.W.
WASHINGTON, DC 20005-3096

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