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Reel/Frame:024373/0786   Pages: 3
Recorded: 05/12/2010
Attorney Dkt #:OGOSH39AUSA
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/19/2017
Application #:
12778283
Filing Dt:
05/12/2010
Publication #:
Pub Dt:
09/02/2010
Title:
Copper Alloy Sputtering Target, Process for Producing the Same and Semiconductor Element Wiring
Assignor
1
Exec Dt:
09/02/2005
Assignee
1
10-1, TORANOMON 2-CHOME
MINATO-KU
TOKYO, JAPAN 105-0001
Correspondence name and address
WILLIAM BAK
501 OFFICE CENTER DRIVE
SUITE 210
FT. WASHINGTON, PA 19034

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