Patent Assignment Details
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| Reel/Frame: | 024443/0446 | |
| Pages: | 2 |
| | Recorded: | 05/26/2010 | | |
| Attorney Dkt #: | Q118920 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12744597
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Filing Dt:
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05/25/2010
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Publication #:
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Pub Dt:
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10/07/2010
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Title:
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SOLDERING FLUX AND SOLDER PASTE COMPOSITION
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Assignee
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| 671-4, MIZUASHI, NOGUCHI-CHO |
| KAKOGAWA-SHI, HYOGO, JAPAN 675-0019 |
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Correspondence name and address
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SUGHRUE MION
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2100 PENNSYLVANIA AVE, NW
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WASHINGTON, DC 20037-3213
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