Patent Assignment Details
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| Reel/Frame: | 024451/0366 | |
| Pages: | 8 |
| | Recorded: | 05/27/2010 | | |
| Attorney Dkt #: | 8836-640 (IJ-190393-US) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/29/2013
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Application #:
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12788956
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Filing Dt:
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05/27/2010
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Publication #:
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Pub Dt:
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12/02/2010
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Title:
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METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE
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Assignee
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| 416, MAETAN-DONG, YEONGTONG-GU, |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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F. CHAU & ASSOCIATES, LLC
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130 WOODBURY ROAD
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WOODBURY, NY 11797
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