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Reel/Frame:024465/0620   Pages: 5
Recorded: 06/01/2010
Attorney Dkt #:INF 2009 P 51327 US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12791443
Filing Dt:
06/01/2010
Publication #:
Pub Dt:
12/01/2011
Title:
Method for Fabricating a Semiconductor Chip Package and Semiconductor Chip Package
Assignors
1
Exec Dt:
05/27/2010
2
Exec Dt:
05/27/2010
3
Exec Dt:
05/27/2010
4
Exec Dt:
05/27/2010
Assignee
1
AM CAMPEON 1-12
NEUBIBERG, GERMANY 85579
Correspondence name and address
SLATER & MATSIL, L.L.P.
17950 PRESTON RD.
SUITE 1000
DALLAS, TX 75252

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