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Reel/Frame:024492/0553   Pages: 4
Recorded: 06/08/2010
Attorney Dkt #:2005P14742 US
Conveyance: MERGER (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/15/2005
Application #:
09435324
Filing Dt:
11/05/1999
Title:
METHOD OF AND APPARATUS FOR WAFER-SCALE PACKAGING OF SURFACE MICROFABRICATED TRANSDUCERS
Assignor
1
Exec Dt:
08/31/2006
Assignee
1
51 VALLEY STREAM PARKWAY
MALVERN, PENNSYLVANIA 19355
Correspondence name and address
SIEMENS CORPORATION
170 WOOD AVENUE SOUTH
ATTN: ELSA KELLER, LEGAL ADMINISTRATOR
ISELIN, NJ 08830

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