Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 024540/0683 | |
| Pages: | 5 |
| | Recorded: | 06/15/2010 | | |
| Attorney Dkt #: | 27-646 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/04/2013
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Application #:
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12787216
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Filing Dt:
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05/25/2010
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Publication #:
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Pub Dt:
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12/01/2011
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EMBEDDED DIE SUPERSTRUCTURE AND METHOD OF MANUFACTURE THEREOF
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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LAW OFFICES OF MIKIO ISHIMARU
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333 W. EL CAMINO REAL
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SUITE 330
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SUNNYVALE, CA 94087
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