Total properties:
76
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|
Patent #:
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|
Issue Dt:
|
12/04/2001
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Application #:
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08116305
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Filing Dt:
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09/03/1993
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Title:
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MOLDED PLASTIC PACKAGE WITH HEAT SINK AND ENHANCED ELECTRICAL PERFORMANCE
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Patent #:
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Issue Dt:
|
03/14/1995
|
Application #:
|
08116944
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Filing Dt:
|
09/03/1993
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Title:
|
TAB GRID ARRAY
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|
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Patent #:
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|
Issue Dt:
|
04/25/1995
|
Application #:
|
08201869
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Filing Dt:
|
02/25/1994
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Title:
|
PROCESS FOR ASSEMBLING A TAB GRID ARRAY PACKAGE FOR AN INTEGRATED CIRCUIT
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Patent #:
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Issue Dt:
|
01/21/1997
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Application #:
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08348288
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Filing Dt:
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11/30/1994
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Title:
|
HIGH POWER DISSIPATION PLASTIC ENCAPSULATED PACKAGE FOR INTEGRATED CIRCUIT DIE
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Patent #:
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|
Issue Dt:
|
12/01/1998
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Application #:
|
08585134
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Filing Dt:
|
01/11/1996
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Title:
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STRUCTURE AND METHOD FOR AUTOMATED ASSEMBLY OF A TAB GRID ARRAY PACKAGE
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Patent #:
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|
Issue Dt:
|
08/29/2000
|
Application #:
|
09020903
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Filing Dt:
|
02/05/1998
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Title:
|
INTEGRATED CARRIER RING/STIFFENER AND METHOD FOR MANUFACTURING A FLEXIBLE INTEGRATED CIRCUIT PACKAGE
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|
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Patent #:
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|
Issue Dt:
|
05/08/2001
|
Application #:
|
09095803
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Filing Dt:
|
06/10/1998
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Title:
|
SAW-SINGULATED LEADLESS PLASTIC CHIP CARRIER
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Patent #:
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|
Issue Dt:
|
09/04/2001
|
Application #:
|
09184787
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Filing Dt:
|
11/02/1998
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Title:
|
INTEGRATED CIRCUIT PACKAGE WITH BONDING PLANES ON A CERAMIC RING USING AN ADHESIVE ASSEMBLY
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Patent #:
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|
Issue Dt:
|
12/24/2002
|
Application #:
|
09288352
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Filing Dt:
|
04/08/1999
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Title:
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LEADLESS PLASTIC CHIP CARRIER WITH ETCH BACK PAD SINGULATION
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Patent #:
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Issue Dt:
|
09/04/2001
|
Application #:
|
09309248
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Filing Dt:
|
05/10/1999
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Title:
|
INTEGRATED CARRIER RING/STIFFENER AND METHOD FOR MANUFACTURING A FLEXIBLE INTEGRATED CIRCUIT PACKAGE
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|
|
Patent #:
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|
Issue Dt:
|
06/05/2001
|
Application #:
|
09363249
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Filing Dt:
|
07/28/1999
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Title:
|
SAW-SINGULATED LEADLESS PLASTIC CHIP CARRIER
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Patent #:
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|
Issue Dt:
|
09/25/2001
|
Application #:
|
09454794
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Filing Dt:
|
12/03/1999
|
Title:
|
EXPOSED DIE LEADLESS PLASTIC CHIP CARRIER
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|
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Patent #:
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|
Issue Dt:
|
08/06/2002
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Application #:
|
09730440
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Filing Dt:
|
12/05/2000
|
Publication #:
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|
Pub Dt:
|
06/06/2002
| | | | |
Title:
|
METAL FOIL LAMINATED IC PACKAGE
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|
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Patent #:
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|
Issue Dt:
|
04/22/2003
|
Application #:
|
09757729
|
Filing Dt:
|
01/09/2001
|
Publication #:
|
|
Pub Dt:
|
06/20/2002
| | | | |
Title:
|
MOLDED PLASTIC PACKAGE WITH HEAT SINK AND ENHANCED ELECTRICAL PERFORMANCE
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|
Patent #:
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Issue Dt:
|
04/08/2003
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Application #:
|
09799968
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Filing Dt:
|
03/06/2001
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Publication #:
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|
Pub Dt:
|
09/12/2002
| | | | |
Title:
|
ENHANCED LEADLESS CHIP CARRIER
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Patent #:
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Issue Dt:
|
08/23/2005
|
Application #:
|
09802678
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Filing Dt:
|
03/09/2001
|
Publication #:
|
|
Pub Dt:
|
07/19/2001
| | | | |
Title:
|
LEADLESS PLASTIC CHIP CARRIER WITH ETCH BACK PAD SINGULATION
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|
Patent #:
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|
Issue Dt:
|
10/21/2003
|
Application #:
|
09802679
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Filing Dt:
|
03/09/2001
|
Publication #:
|
|
Pub Dt:
|
08/16/2001
| | | | |
Title:
|
LEADLESS PLASTIC CHIP CARRIER WITH ETCH BACK PAD SINGULATION AND DIE ATTACH PAD ARRAY
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|
|
Patent #:
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|
Issue Dt:
|
05/11/2004
|
Application #:
|
09902878
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Filing Dt:
|
07/11/2001
|
Publication #:
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|
Pub Dt:
|
01/16/2003
| | | | |
Title:
|
ENHANCED THERMAL DISSIPATION INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING ENHANCED THERMAL DISSIPATION INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
|
09/14/2004
|
Application #:
|
10062650
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Filing Dt:
|
01/31/2002
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Publication #:
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Pub Dt:
|
07/31/2003
| | | | |
Title:
|
METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT PACKAGE
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|
Patent #:
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|
Issue Dt:
|
07/01/2003
|
Application #:
|
10115228
|
Filing Dt:
|
04/03/2002
|
Title:
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LEADLESS PLASTIC CHIP CARRIER WITH PARTIAL ETCH DIE ATTACH PAD
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|
Patent #:
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|
Issue Dt:
|
05/11/2004
|
Application #:
|
10166458
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Filing Dt:
|
06/10/2002
|
Title:
|
MULTIPLE LEADFRAME LAMINATED IC PACKAGE
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|
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Patent #:
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|
Issue Dt:
|
09/06/2005
|
Application #:
|
10178372
|
Filing Dt:
|
06/24/2002
|
Publication #:
|
|
Pub Dt:
|
12/25/2003
| | | | |
Title:
|
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING THE INTEGRATED CIRCUIT PACKAGE
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|
|
Patent #:
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|
Issue Dt:
|
10/05/2004
|
Application #:
|
10197832
|
Filing Dt:
|
07/19/2002
|
Title:
|
BALL GRID ARRAY PACKAGE
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|
|
Patent #:
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|
Issue Dt:
|
12/23/2003
|
Application #:
|
10211567
|
Filing Dt:
|
08/05/2002
|
Title:
|
CHIP SCALE INTEGRATED CIRCUIT PACKAGE
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|
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Patent #:
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|
Issue Dt:
|
11/23/2004
|
Application #:
|
10232678
|
Filing Dt:
|
09/03/2002
|
Title:
|
PREMOLDED CAVITY IC PACKAGE
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|
|
Patent #:
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|
Issue Dt:
|
04/20/2004
|
Application #:
|
10269332
|
Filing Dt:
|
10/11/2002
|
Publication #:
|
|
Pub Dt:
|
02/27/2003
| | | | |
Title:
|
MOLDED PLASTIC PACKAGE WITH HEAT SINK AND ENHANCED ELECTRICAL PERFORMANCE
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|
|
Patent #:
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|
Issue Dt:
|
11/16/2004
|
Application #:
|
10299622
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Filing Dt:
|
11/19/2002
|
Title:
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BALL GRID ARRAY PACKAGE WITH SHIELDING
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|
|
Patent #:
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|
Issue Dt:
|
08/24/2004
|
Application #:
|
10307279
|
Filing Dt:
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12/02/2002
|
Title:
|
THIN BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
|
03/29/2005
|
Application #:
|
10318262
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Filing Dt:
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12/13/2002
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Title:
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LEADLESS PLASTIC CHIP CARRIER WITH ETCH BACK PAD SINGULATION AND DIE ATTACH PAD ARRAY
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Patent #:
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|
Issue Dt:
|
05/18/2004
|
Application #:
|
10322661
|
Filing Dt:
|
12/19/2002
|
Title:
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BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CHARACTERISTICS
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Patent #:
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Issue Dt:
|
12/27/2005
|
Application #:
|
10323657
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Filing Dt:
|
12/20/2002
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Title:
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PROCESS FOR MANUFACTURING BALL GRID ARRAY PACKAGE
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Patent #:
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|
Issue Dt:
|
07/04/2006
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Application #:
|
10323658
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Filing Dt:
|
12/20/2002
|
Title:
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SHIELDED INTEGRATED CIRCUIT PACKAGE
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Patent #:
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|
Issue Dt:
|
01/24/2006
|
Application #:
|
10353241
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Filing Dt:
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01/28/2003
|
Title:
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LEADLESS PLASTIC CHIP CARRIER WITH ETCH BACK PAD SINGULATION
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Patent #:
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Issue Dt:
|
11/16/2004
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Application #:
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10372421
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Filing Dt:
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02/24/2003
|
Title:
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BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
|
11/16/2004
|
Application #:
|
10430331
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Filing Dt:
|
05/07/2003
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Title:
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STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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01/17/2006
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Application #:
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10643961
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Filing Dt:
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08/20/2003
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Title:
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BALL GRID ARRAY PACKAGE AND PROCESS FOR MANUFACTURING SAME
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Patent #:
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Issue Dt:
|
08/23/2005
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Application #:
|
10647696
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Filing Dt:
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08/25/2003
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Title:
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BALL GRID ARRAY PACKAGE AND PROCESS FOR MANUFACTURING SAME
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Patent #:
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Issue Dt:
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05/13/2008
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Application #:
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10660611
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Filing Dt:
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09/12/2003
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Title:
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BALL GRID ARRAY PACKAGE AND PROCESS FOR MANUFACTURING SAME
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Patent #:
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Issue Dt:
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06/07/2005
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Application #:
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10660612
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Filing Dt:
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09/12/2003
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Title:
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PROCESS FOR DRESSING MOLDED ARRAY PACKAGE SAW BLADE
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Patent #:
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Issue Dt:
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04/25/2006
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Application #:
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10661480
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Filing Dt:
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09/15/2003
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Title:
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METHOD OF FABRICATING A LEADLESS PLASTIC CHIP CARRIER
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Patent #:
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Issue Dt:
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10/21/2008
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Application #:
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10678417
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Filing Dt:
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10/03/2003
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Title:
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THIN BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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05/29/2007
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Application #:
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10678419
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Filing Dt:
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10/03/2003
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Title:
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FLIP CHIP BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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11/11/2008
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Application #:
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10681983
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Filing Dt:
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10/09/2003
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Title:
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MULTIPLE LEADFRAME LAMINATED IC PACKAGE
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Patent #:
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Issue Dt:
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01/10/2006
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Application #:
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10694511
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Filing Dt:
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10/27/2003
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Title:
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THERMALLY ENHANCED CAVITY-DOWN INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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09/20/2005
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Application #:
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10697339
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Filing Dt:
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10/30/2003
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Title:
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PROCESS FOR FABRICATING A LEADLESS PLASTIC CHIP CARRIER
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Patent #:
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Issue Dt:
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11/15/2005
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Application #:
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10757499
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Filing Dt:
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01/15/2004
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Title:
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ELECTRONIC COMPONENTS SUCH AS THIN ARRAY PLASTIC PACKAGES AND PROCESS FOR FABRICATING SAME
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Patent #:
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Issue Dt:
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03/07/2006
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Application #:
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10757508
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Filing Dt:
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01/15/2004
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Title:
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THIN LEADLESS PLASTIC CHIP CARRIER
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Patent #:
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Issue Dt:
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01/03/2006
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Application #:
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10759247
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Filing Dt:
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01/20/2004
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Title:
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SENSOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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05/23/2006
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Application #:
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10765192
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Filing Dt:
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01/28/2004
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Title:
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LEADLESS PLASTIC CHIP CARRIER WITH STANDOFF CONTACTS AND DIE ATTACH PAD
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Patent #:
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Issue Dt:
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01/11/2005
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Application #:
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10800973
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Filing Dt:
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03/16/2004
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Title:
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PREMOLDED CAVITY IC PACKAGE
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Patent #:
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Issue Dt:
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03/21/2006
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Application #:
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10803782
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Filing Dt:
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03/18/2004
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Publication #:
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Pub Dt:
|
01/06/2005
| | | | |
Title:
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METHOD OF MANUFACTURING AN ENHANCED THERMAL DISSIPATION INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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08/15/2006
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Application #:
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10865760
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Filing Dt:
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06/14/2004
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Title:
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INTEGRATED CIRCUIT PACKAGE AND PROCESS FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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01/01/2008
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Application #:
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10885965
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Filing Dt:
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07/08/2004
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Title:
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BALL GRID ARRAY PACKAGE THAT INCLUDES A COLLAPSIBLE SPACER FOR SEPARATING DIE ADAPTER FROM A HEAT SPREADER
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Patent #:
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Issue Dt:
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06/03/2008
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Application #:
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10885966
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Filing Dt:
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07/08/2004
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Title:
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SHIELDED INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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08/12/2008
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Application #:
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10891709
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Filing Dt:
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07/15/2004
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Title:
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INTEGRATED CIRCUIT PACKAGE WITH PARTIALLY EXPOSED CONTACT PADS AND PROCESS FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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09/29/2009
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Application #:
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10957576
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Filing Dt:
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10/05/2004
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Title:
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LEADLESS PLASTIC CHIP CARRIER WITH CONTACT STANDOFF
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Patent #:
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Issue Dt:
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06/08/2010
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Application #:
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10985233
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Filing Dt:
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11/10/2004
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Title:
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CAVITY-TYPE INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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05/13/2008
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Application #:
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10990008
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Filing Dt:
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11/16/2004
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Title:
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PROCESS FOR FABRICATING AN INTEGRATED CIRCUIT PACKAGE WITH REDUCED MOLD WARPING
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Patent #:
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Issue Dt:
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12/11/2012
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Application #:
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11008593
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Filing Dt:
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12/09/2004
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Title:
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INTEGRATED CIRCUIT PACKAGE HAVING A PLURALITY OF SPACED APART PAD PORTIONS
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Patent #:
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Issue Dt:
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09/18/2007
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Application #:
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11022130
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Filing Dt:
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12/22/2004
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Title:
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LEADLESS PLASTIC CHIP CARRIER
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Patent #:
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04/15/2008
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Application #:
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11033928
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01/12/2005
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Publication #:
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Pub Dt:
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07/13/2006
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Title:
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THIN ARRAY PLASTIC PACKAGE WITHOUT DIE ATTACH PAD AND PROCESS FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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12/17/2013
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11061895
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02/18/2005
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Title:
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BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CHARACTERISTICS
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Patent #:
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Issue Dt:
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01/27/2009
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11071737
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03/03/2005
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Title:
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ELECTRONIC COMPONENTS SUCH AS THIN ARRAY PLASTIC PACKAGES AND PROCESS FOR FABRICATING SAME
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Patent #:
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02/07/2006
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Application #:
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11123489
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05/06/2005
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Title:
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LEADLESS PLASTIC CHIP CARRIER WITH ETCH BACK PAD SINGULATION
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09/18/2007
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11123491
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05/06/2005
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Title:
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LEADLESS PLASTIC CHIP CARRIER WITH ETCH BACK PAD SINGULATION
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07/24/2007
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11137973
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05/25/2005
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Title:
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PROCESS FOR FABRICATING AN INTEGRATED CIRCUIT PACKAGE
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07/25/2006
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11151469
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06/13/2005
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Title:
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THIN LEADLESS PLASTIC CHIP CARRIER
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Patent #:
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Issue Dt:
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06/05/2007
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11175663
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07/06/2005
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Title:
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PROCESS FOR FABRICATING A LEADLESS PLASTIC CHIP CARRIER
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Patent #:
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Issue Dt:
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03/25/2008
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Application #:
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11183290
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Filing Dt:
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07/15/2005
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Title:
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INTEGRATED CIRCUIT PACKAGE AND METHOD FOR FABRICATING SAME
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Patent #:
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Issue Dt:
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03/11/2008
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Application #:
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11191678
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07/28/2005
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Title:
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THERMALLY ENHANCED CAVITY-DOWN INTEGRATED CIRCUIT PACKAGE
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Patent #:
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06/19/2007
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Application #:
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11194993
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Filing Dt:
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08/02/2005
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Title:
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PROCESS FOR FABRICATING PAD FRAME AND INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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08/12/2008
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11234963
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Filing Dt:
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09/26/2005
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Title:
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LEADLESS PLASTIC CHIP CARRIER AND METHOD OF FABRICATING SAME
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11377425
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Filing Dt:
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03/17/2006
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Publication #:
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Pub Dt:
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10/05/2006
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Title:
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Ball grid array package and process for manufacturing same
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Patent #:
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Issue Dt:
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03/18/2008
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11798417
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05/14/2007
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Title:
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INTEGRATED CIRCUIT PACKAGE AND METHOD FOR FABRICATING SAME
|
|
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Patent #:
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Issue Dt:
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10/31/2017
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Application #:
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11916242
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Filing Dt:
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10/07/2010
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Publication #:
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Pub Dt:
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11/24/2011
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Title:
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ETCH ISOLATION LPCC/QFN STRIP
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Patent #:
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Issue Dt:
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12/28/2010
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Application #:
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12400391
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Filing Dt:
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03/09/2009
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Publication #:
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Pub Dt:
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09/09/2010
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Title:
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LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DIE ATTACH PAD
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