Patent Assignment Details
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| Reel/Frame: | 024603/0857 | |
| Pages: | 3 |
| | Recorded: | 06/28/2010 | | |
| Attorney Dkt #: | ALPSP392 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/21/2012
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Application #:
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12823088
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Filing Dt:
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06/24/2010
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Publication #:
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Pub Dt:
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10/14/2010
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Title:
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RESIN BONDING METHOD BY PHOTOIRRADIATION, METHOD FOR PRODUCING RESIN ARTICLE, RESIN ARTICLE PRODUCED BY THE SAME METHOD, METHOD FOR PRODUCING MICROCHIP, AND MICROCHIP PRODUCED BY THE SAME METHOD
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Assignee
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| 1-7, YUKIGAYA-OTSUKAMACHI, OTA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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BEYER LAW GROUP LLP
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P.O BOX 1687
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CUPERTINO, CA 95015
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