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Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:024640/0301   Pages: 11
Recorded: 07/07/2010
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 36
1
Patent #:
6812718
Issue Dt:
11/02/2004
Application #:
09979551
Filing Dt:
11/21/2001
Title:
MASSIVELY PARALLEL INTERFACE FOR ELECTRONIC CIRCUITS
2
Patent #:
6799976
Issue Dt:
10/05/2004
Application #:
09980040
Filing Dt:
11/27/2001
Title:
CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR INTEGRATED CIRCUIT WAFER PROBE CARD ASSEMBLIES
3
Patent #:
6791171
Issue Dt:
09/14/2004
Application #:
10069902
Filing Dt:
06/28/2002
Publication #:
US20020171133
Pub Dt:
11/21/2002
Title:
SYSTEMS FOR TESTING AND PACKAGING INTEGRATED CIRCUITS
4
Patent #:
NONE
Issue Dt:
09/14/2004
Application #:
10069902
Filing Dt:
06/28/2002
Publication #:
US20020171133
Pub Dt:
11/21/2002
PCT #:
US0119792
Title:
SYSTEMS FOR TESTING AND PACKAGING INTEGRATED CIRCUITS
5
Patent #:
6815961
Issue Dt:
11/09/2004
Application #:
10094370
Filing Dt:
03/08/2002
Publication #:
US20040022042
Pub Dt:
02/05/2004
Title:
CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR INTEGRATED CIRCUIT WAFER PROBE CARD ASSEMBLIES
6
Patent #:
6917525
Issue Dt:
07/12/2005
Application #:
10178103
Filing Dt:
06/24/2002
Publication #:
US20030099097
Pub Dt:
05/29/2003
Title:
CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR PROBE CARD ASSEMBLIES AND PACKAGES HAVING WAFER LEVEL SPRINGS
7
Patent #:
6710609
Issue Dt:
03/23/2004
Application #:
10196494
Filing Dt:
07/15/2002
Publication #:
US20040008045
Pub Dt:
01/15/2004
Title:
MOSAIC DECAL PROBE
8
Patent #:
7126220
Issue Dt:
10/24/2006
Application #:
10390988
Filing Dt:
03/17/2003
Publication #:
US20030218244
Pub Dt:
11/27/2003
Title:
MINIATURIZED CONTACT SPRING
9
Patent #:
7137830
Issue Dt:
11/21/2006
Application #:
10390994
Filing Dt:
03/17/2003
Publication #:
US20030214045
Pub Dt:
11/20/2003
Title:
MINIATURIZED CONTACT SPRING
10
Patent #:
7153399
Issue Dt:
12/26/2006
Application #:
10487652
Filing Dt:
02/19/2004
Publication #:
US20050003196
Pub Dt:
01/06/2005
Title:
METHOD AND APPARATUS OF PRODUCING UNIFORM ISOTROPIC STRESSES IN A SPUTTERED FILM
11
Patent #:
NONE
Issue Dt:
12/26/2006
Application #:
10487652
Filing Dt:
02/19/2004
Publication #:
US20050003196
Pub Dt:
01/06/2005
PCT #:
US0226785
Title:
METHOD AND APPARATUS OF PRODUCING UNIFORM ISOTROPIC STRESSES IN A SPUTTERED FILM
12
Patent #:
NONE
Issue Dt:
Application #:
10717813
Filing Dt:
11/19/2003
Publication #:
US20040075455
Pub Dt:
04/22/2004
Title:
Mosaic decal probe
13
Patent #:
7349223
Issue Dt:
03/25/2008
Application #:
10870095
Filing Dt:
06/16/2004
Publication #:
US20040223309
Pub Dt:
11/11/2004
Title:
ENHANCED COMPLIANT PROBE CARD SYSTEMS HAVING IMPROVED PLANARITY
14
Patent #:
NONE
Issue Dt:
Application #:
10888761
Filing Dt:
07/09/2004
Publication #:
US20050068054
Pub Dt:
03/31/2005
Title:
Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies
15
Patent #:
7009412
Issue Dt:
03/07/2006
Application #:
10918511
Filing Dt:
08/12/2004
Publication #:
US20050051353
Pub Dt:
03/10/2005
Title:
MASSIVELY PARALLEL INTERFACE FOR ELECTRONIC CIRCUIT
16
Patent #:
7247035
Issue Dt:
07/24/2007
Application #:
10932552
Filing Dt:
09/01/2004
Publication #:
US20060240690
Pub Dt:
10/26/2006
Title:
ENHANCED STRESS METAL SPRING CONTACTOR
17
Patent #:
7126358
Issue Dt:
10/24/2006
Application #:
10951314
Filing Dt:
09/27/2004
Publication #:
US20050042932
Pub Dt:
02/24/2005
Title:
CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR INTEGRATED CIRCUIT WAFER PROBE CARD ASSEMBLIES
18
Patent #:
7382142
Issue Dt:
06/03/2008
Application #:
11133021
Filing Dt:
05/18/2005
Publication #:
US20050275418
Pub Dt:
12/15/2005
Title:
HIGH DENSITY INTERCONNECT SYSTEM HAVING RAPID FABRICATION CYCLE
19
Patent #:
7138818
Issue Dt:
11/21/2006
Application #:
11327728
Filing Dt:
01/05/2006
Publication #:
US20060119377
Pub Dt:
06/08/2006
Title:
MASSIVELY PARALLEL INTERFACE FOR ELECTRONIC CIRCUIT
20
Patent #:
7579848
Issue Dt:
08/25/2009
Application #:
11350049
Filing Dt:
02/07/2006
Publication #:
US20060186906
Pub Dt:
08/24/2006
Title:
HIGH DENSITY INTERCONNECT SYSTEM FOR IC PACKAGES AND INTERCONNECT ASSEMBLIES
21
Patent #:
7952373
Issue Dt:
05/31/2011
Application #:
11552110
Filing Dt:
10/23/2006
Publication #:
US20070046304
Pub Dt:
03/01/2007
Title:
CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR INTEGRATED CIRCUIT WAFER PROBE CARD ASSEMBLIES
22
Patent #:
7403029
Issue Dt:
07/22/2008
Application #:
11555603
Filing Dt:
11/01/2006
Publication #:
US20070057684
Pub Dt:
03/15/2007
Title:
MASSIVELY PARALLEL INTERFACE FOR ELECTRONIC CIRCUIT
23
Patent #:
NONE
Issue Dt:
Application #:
11556134
Filing Dt:
11/02/2006
Publication #:
US20070144841
Pub Dt:
06/28/2007
Title:
Miniaturized Contact Spring
24
Patent #:
NONE
Issue Dt:
Application #:
11563664
Filing Dt:
11/27/2006
Publication #:
US20070098895
Pub Dt:
05/03/2007
Title:
Method and Apparatus for Producing Uniform, Isotropic Stresses in a Sputtered Film
25
Patent #:
NONE
Issue Dt:
Application #:
11692138
Filing Dt:
03/27/2007
Publication #:
US20070245553
Pub Dt:
10/25/2007
Title:
FINE PITCH MICROFABRICATED SPRING CONTACT STRUCTURE & METHOD
26
Patent #:
7621761
Issue Dt:
11/24/2009
Application #:
11781172
Filing Dt:
07/20/2007
Publication #:
US20080090429
Pub Dt:
04/17/2008
Title:
SYSTEMS FOR TESTING AND PACKAGING INTEGRATED CIRCUITS
27
Patent #:
7872482
Issue Dt:
01/18/2011
Application #:
11858064
Filing Dt:
09/19/2007
Publication #:
US20080246500
Pub Dt:
10/09/2008
Title:
HIGH DENSITY INTERCONNECT SYSTEM HAVING RAPID FABRICATION CYCLE
28
Patent #:
NONE
Issue Dt:
Application #:
11995490
Filing Dt:
12/05/2008
Publication #:
US20090090617
Pub Dt:
04/09/2009
Title:
Method and Apparatus for Producing Controlled Stresses and Stress Gradients in Sputtered Films
29
Patent #:
NONE
Issue Dt:
Application #:
11995490
Filing Dt:
12/05/2008
Publication #:
US20090090617
Pub Dt:
04/09/2009
PCT #:
US0627423
Title:
Method and Apparatus for Producing Controlled Stresses and Stress Gradients in Sputtered Films
30
Patent #:
7772860
Issue Dt:
08/10/2010
Application #:
12175393
Filing Dt:
07/17/2008
Publication #:
US20080297186
Pub Dt:
12/04/2008
Title:
MASSIVELY PARALLEL INTERFACE FOR ELECTRONIC CIRCUIT
31
Patent #:
7884634
Issue Dt:
02/08/2011
Application #:
12354520
Filing Dt:
01/15/2009
Publication #:
US20090153165
Pub Dt:
06/18/2009
Title:
HIGH DENSITY INTERCONNECT SYSTEM HAVING RAPID FABRICATION CYCLE
32
Patent #:
NONE
Issue Dt:
Application #:
12517528
Filing Dt:
06/03/2009
Publication #:
US20120212248
Pub Dt:
08/23/2012
PCT #:
US0786394
Title:
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
33
Patent #:
NONE
Issue Dt:
Application #:
12517528
Filing Dt:
06/03/2009
Publication #:
US20120212248
Pub Dt:
08/23/2012
Title:
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies
34
Patent #:
8575954
Issue Dt:
11/05/2013
Application #:
12525051
Filing Dt:
05/26/2010
Publication #:
US20100244867
Pub Dt:
09/30/2010
Title:
STRUCTURES AND PROCESSES FOR FABRICATION OF PROBE CARD ASSEMBLIES WITH MULTI-LAYER INTERCONNECT
35
Patent #:
8575954
Issue Dt:
11/05/2013
Application #:
12525051
Filing Dt:
05/26/2010
Publication #:
US20100244867
Pub Dt:
09/30/2010
PCT #:
US0852644
Title:
STRUCTURES AND PROCESSES FOR FABRICATION OF PROBE CARD ASSEMBLIES WITH MULTI-LAYER INTERCONNECT
36
Patent #:
7812626
Issue Dt:
10/12/2010
Application #:
12546432
Filing Dt:
08/24/2009
Publication #:
US20100066393
Pub Dt:
03/18/2010
Title:
HIGH DENSITY INTERCONNECT SYSTEM FOR IC PACKAGES AND INTERCONNECT ASSEMBLIES
Assignor
1
NANONEXUS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Exec Dt:
06/01/2010
Assignee
1
VERIGY (SINGAPORE) PTE. LTD.
NO. 1 YISHUN AVENUE 7
SINGAPORE, SINGAPORE 768923
Correspondence name and address
GREGORY W. OSTERLOTH
P.O. BOX 8749
DENVER, CO 80201

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