Patent Assignment Details
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| Reel/Frame: | 024704/0217 | |
| Pages: | 3 |
| | Recorded: | 07/15/2010 | | |
| Attorney Dkt #: | 10USFP2388-T.F. |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12662811
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Filing Dt:
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05/04/2010
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Publication #:
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Pub Dt:
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11/18/2010
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Title:
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Semiconductor package, lead frame, and wiring board with the same
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Assignee
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| 1753 SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI, KANAGAWA, JAPAN 211-8668 |
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Correspondence name and address
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SEAN M. MCGINN, ESQ.
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MCGINN IP LAW GROUP, PLLC
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8321 OLD COURTHOUSE ROAD, STE. 200
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VIENNA, VA 22182-3817
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