Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 024728/0467 | |
| Pages: | 5 |
| | Recorded: | 07/22/2010 | | |
Attorney Dkt #: | 069576-0010 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
8
|
|
Patent #:
|
|
Issue Dt:
|
09/21/2010
|
Application #:
|
11565569
|
Filing Dt:
|
11/30/2006
|
Publication #:
|
|
Pub Dt:
|
08/09/2007
| | | | |
Title:
|
DRIVE DEVICE OF COLOR LED BACKLIGHT
|
|
|
Patent #:
|
|
Issue Dt:
|
03/23/2010
|
Application #:
|
11657083
|
Filing Dt:
|
01/24/2007
|
Publication #:
|
|
Pub Dt:
|
07/26/2007
| | | | |
Title:
|
LED DRIVING APPARATUS WITH TEMPERATURE COMPENSATION FUNCTION
|
|
|
Patent #:
|
|
Issue Dt:
|
01/04/2011
|
Application #:
|
11710436
|
Filing Dt:
|
02/26/2007
|
Publication #:
|
|
Pub Dt:
|
08/30/2007
| | | | |
Title:
|
LIGHT EMITTING DIODE PACKAGE, CIRCUIT BOARD FOR LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
11/15/2011
|
Application #:
|
11723059
|
Filing Dt:
|
03/16/2007
|
Publication #:
|
|
Pub Dt:
|
09/20/2007
| | | | |
Title:
|
ANODIZED METAL SUBSTRATE MODULE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/16/2011
|
Application #:
|
11723236
|
Filing Dt:
|
03/19/2007
|
Publication #:
|
|
Pub Dt:
|
09/20/2007
| | | | |
Title:
|
INSULATION STRUCTURE FOR HIGH TEMPERATURE CONDITIONS AND MANUFACTURING METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
11/22/2011
|
Application #:
|
11896769
|
Filing Dt:
|
09/05/2007
|
Publication #:
|
|
Pub Dt:
|
03/06/2008
| | | | |
Title:
|
COMPONENT EMBEDDED PRINTED CIRCUIT BOARD
|
|
|
Patent #:
|
|
Issue Dt:
|
09/13/2011
|
Application #:
|
12213809
|
Filing Dt:
|
06/25/2008
|
Publication #:
|
|
Pub Dt:
|
12/31/2009
| | | | |
Title:
|
DIMMING BUCK TYPE LED DRIVING APPARATUS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/19/2011
|
Application #:
|
12369143
|
Filing Dt:
|
02/11/2009
|
Publication #:
|
|
Pub Dt:
|
03/11/2010
| | | | |
Title:
|
METHOD OF NICKEL-GOLD PLATING AND PRINTED CIRCUIT BOARD
|
|
Assignees
|
|
|
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, |
GYUNGGI-DO, KOREA, REPUBLIC OF |
|
|
|
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, |
GYUNGGI-DO, KOREA, REPUBLIC OF |
|
Correspondence name and address
|
|
MCDERMOTT WILL & EMERY LLP
|
|
600 THIRTEENTH STREET, N.W.
|
|
WASHINGTON, DC 20005-3096
|
Search Results as of:
05/21/2024 10:27 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|