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Total properties:
11
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Patent #:
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Issue Dt:
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01/24/1995
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Application #:
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08058120
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Filing Dt:
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05/05/1993
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Title:
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OFF-AXIS POWER BRANCHES FOR INTERIOR BOND PAD ARRANGEMENTS
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Patent #:
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Issue Dt:
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10/08/1996
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Application #:
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08187238
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Filing Dt:
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01/25/1994
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Title:
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SURFACE MOUNT PERIPHERAL LEADED AND BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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07/01/1997
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Application #:
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08377211
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Filing Dt:
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01/23/1995
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Title:
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PROCESS FOR MANUFACTURING OFF-AXIS POWER BRANCHES FOR INTERIOR BOND PAD ARRANGEMENTS
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Patent #:
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Issue Dt:
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10/22/1996
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Application #:
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08469086
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Filing Dt:
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06/05/1995
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Title:
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METHOD FOR FORMING INTERIOR BOND PADS HAVING ZIG-ZAG LINEAR ARRANGE- MENT
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Patent #:
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Issue Dt:
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08/04/1998
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Application #:
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08725735
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Filing Dt:
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10/04/1996
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Title:
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SURFACE MOUNT PERIPHERAL LEADED AND BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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02/09/1999
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Application #:
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08840614
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Filing Dt:
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04/21/1997
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Title:
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THIN POWER TAPE BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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12/03/2002
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Application #:
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09703199
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Filing Dt:
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10/31/2000
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Title:
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MOLDED TAPE BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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02/25/2003
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Application #:
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09846080
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Filing Dt:
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05/01/2001
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Title:
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MOLDED INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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08/17/2004
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Application #:
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10164494
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Filing Dt:
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06/06/2002
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Title:
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INTEGRATED CIRCUIT PACKAGE SUBSTRATE WITH MULTIPLE VOLTAGE SUPPLIES
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Patent #:
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Issue Dt:
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11/30/2004
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Application #:
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10308310
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Filing Dt:
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12/03/2002
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Publication #:
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Pub Dt:
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06/03/2004
| | | | |
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Title:
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STIFFENER DESIGN
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Patent #:
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Issue Dt:
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09/02/2008
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Application #:
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10873387
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Filing Dt:
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06/22/2004
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Publication #:
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Pub Dt:
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12/22/2005
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Title:
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HEAT SPREADER IN INTEGRATED CIRCUIT PACKAGE
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