Patent Assignment Details
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| Reel/Frame: | 024749/0335 | |
| Pages: | 4 |
| | Recorded: | 07/27/2010 | | |
| Attorney Dkt #: | 81716.0236 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12864862
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Filing Dt:
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07/27/2010
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Publication #:
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Pub Dt:
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12/09/2010
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Title:
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High Frequency Wiring Board, Package for Housing Electronic Component, Electronic Device, and Communication Apparatus
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Assignee
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| 6, TAKEDA TOBADONO-CHO, FUSHIMI-KU |
| KYOTO-SHI, KYOTO, JAPAN 612-8501 |
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Correspondence name and address
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HOGAN LOVELLS US LLP
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1999 AVENUE OF THE STARS
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SUITE 1400
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LOS ANGELES, CA 90067
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