Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 024805/0144 | |
| Pages: | 5 |
| | Recorded: | 08/06/2010 | | |
| Attorney Dkt #: | 2515.0232 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/25/2014
|
Application #:
|
12852433
|
Filing Dt:
|
08/06/2010
|
|
Publication #:
|
|
Pub Dt:
|
02/09/2012
| | | | |
|
Title:
|
Semiconductor Die and Method of Forming FO-WLCSP Vertical Interconnect Using TSV and TMV
|
|
|
Assignee
|
|
|
|
|
| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
|
|
Correspondence name and address
|
| |
ROBERT D. ATKINS
|
| |
605 W. KNOX ROAD
|
| |
SUITE 104
|
| |
TEMPE, AZ 85284
|
Search Results as of:
05/13/2024 09:25 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
